GORE™ G410 Prepreg
GORE G410 Prepreg allows production of reliable, high performance, single-chip substrate packages using modified printed circuit board construction techniques. GORE G410 Prepreg delivers the high performance organic substrate at a reasonable cost.
-
How to Buy
For more information about buying this product or to request a quote, please contact us.
-
Typical Material Properties
| Property | Method | Value* |
|---|---|---|
|
Dielectric constant 500 MHz |
Split post resonant cavity |
3.4 |
|
10 GHz |
Kent cavity |
3.4 |
|
40 GHz |
DI Model 600T Open Resonator |
3.3 |
|
Loss tangent 500 MHz |
Split post resonant cavity |
0.008 |
|
10 GHz |
Kent cavity |
0.008 |
|
40 GHz |
DI Model 600T Open Resonator |
0.008 |
|
Glass transition temperature (Tg) |
TMA |
220°C |
|
Coefficient of thermal expansion (CTE ) |
TMA (–55 to +125°C) |
19 ppm/°C (X, Y, Z) |
|
Thermal conductivity |
(–67 to +257°F) ASTM E1530 at 20°C (68°F) |
0.46 W/mK |
|
Flammability |
UL |
94 V-0** |
|
Tensile modulus |
at 25°C (77°F) |
12.2 GPa |
|
Moisture absorption |
24-hr. immersion, 20° C |
0.17 % w/w |
|
Peel strength |
IPC TM650 Method 2.4.9 17 µm copper (1/2 oz) |
0.6 Kg/cm |
|
Pressed thickness |
IPC TM650 Method 2.4.38 |
63 μm |
* Typical properties are not specification limits, but nominal performance values
** Tested to UL flammability requirements by an independent lab
Substrate Reliability Information
| Item | Test Method | Condition | Result |
|---|---|---|---|
|
Preconditioning |
JEDEC JESD22-A113A Level 3 |
30°C; 60% RH; followed by 3 reflows at 225°C |
Pass |
|
Thermal shock |
JESD22-A106A Condition C |
15 cycles; –55°C to +125°C; liquid-to-liquid |
Pass |
|
Thermal cycling |
JESD22-A104A Condition B |
3,000 cycles; –55°C to +125°C; air-to-air |
Pass |
|
Pressure cooker test |
JEDEC JESD22-A102B |
168 hrs; 15 psig; 121°C |
Pass |
|
High temperature storage |
JESD22-A103A |
150°C; 1,000 hrs |
Pass |
|
Temperature humidity bias (THB) |
JEDEC JESD22-A101A |
85°C; 85% RH; 1,000 hrs; 5 V bias |
Pass |
|
Solderability |
MIL-STD-883 Method 2003 |
8 hrs steam aging; followed by immersion in solder |
Pass |
|
HAST |
JESD22-A110A |
130°C; 85% RH; 5 V; 96 hrs |
Pass |
Advantages
- Excellent dimensional stability for fine line processing
- Stable Dk and Df over a wide frequency range
- CTE matched to copper in X, Y, and Z-axis, allowing high aspect ratio vias
- Superior thickness control for superior power distribution impedance
- Proven moisture reliability
- High Tg (225°C)
- Processes with standard PWB techniques