GORE™ G620 Prepreg
GORE G620 Prepreg allows production of reliable, cost sensitive, chip-set substrate packages using standard build-up construction techniques. GORE G620 offers improved electrical performance with reduced processing cost.
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How to Buy
For more information about buying this product or to request a quote, please contact us.
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Typical Material Properties
|
Property |
Method | Value* |
|---|---|---|
|
Dielectric constant 3 GHz |
LCR Air Gap |
2.8 |
|
Loss tangent 3 GHz |
LCR Air Gap |
0.015 |
|
Glass transition temperature (Tg) |
TMA |
155°C |
|
Coefficient of thermal expansion (CTE ) |
TMA (–55 to +125°C) |
55 ppm/°C (X, Y, Z) |
|
Flammability |
UL |
94 V-0 |
|
Moisture absorption |
24-hr. immersion, 20° C |
0.1 % w/w |
|
Peel strength |
IPC TM650 Method 2.4.9 17 µm copper (1/2 oz) |
1.1 Kg/cm |
|
Pressed thicknesses |
IPC TM650 Method 2.4.38 |
30, 40, 60 µm |
* Typical properties are not specification limits, but nominal performance values
Substrate Reliability Information
| Item | Test Method | Condition | Result |
|---|---|---|---|
|
Preconditioning |
JEDEC JESD22-A113A Level 3 |
30°C; 60% RH; followed by 3 reflows at 225°C |
Pass |
|
Thermal cycling |
JESD22-A104A Condition C |
3,000 cycles; –65°C to +155°C; air-to-air |
Pass |
|
Pressure cooker test |
JEDEC JESD22-A102C,D |
168 hrs; 15 psig; 121°C |
Pass |
|
High temperature storage (HST) |
JESD22-A103B |
150°C; 1,000 hrs |
Pass |
|
Highly Accelerated Temperature and Humidity (HAST) |
JEDEC JESD22-A101B |
130°C; 85% RH; 33.3 Psig, 96 hrs |
Pass |
Advantages
- Superior laser drilling speeds and quality
- Stable Dk and Df over a wide frequency range
- Excellent thickness control for superior power distribution impedance
- Proven moisture reliability
- Processes with standard build-up substrate package techniques
Typical Applications
- Traditional build-up style chip package substrates
- Flipchip and wirebond chip set substrates