Dielectric Materials
 Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages and improved reliability designed to meet the most demanding cost performance requirements.
Gore dielectric products are found in applications throughout such industries as Telecommunications, Computing, Test and Measurement, Defense, and Aerospace. Performance requirements for these industries include superior signal integrity, higher density, faster signal speeds, thinner construction, improved crack resistance, environmental solutions, and lighter weight. From cost-effective solutions for wireless modules to reliable materials that withstand the extreme conditions of satellite applications, Gore continues to meet these performance challenges through advanced product development, manufacturing excellence, and dedicated customer support.
Applications
Material Properties
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GORE G410 Prepreg allows production of reliable, high performance, single-chip substrate packages using modified printed circuit board construction techniques.
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GORE G620 Prepreg allows production of reliable, cost sensitive, chip-set substrate packages using standard build-up construction techniques.
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GORE SPEEDBOARD C Prepreg allows board designers to reap the high performance benefits of low Dk materials while fabricating on standard FR-4 manufacturing equipment.
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GORE™ SPEEDBOARD LF Prepreg—the lowest loss, lowest Dk thermoset prepreg compatible with all commercial laminates.
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