SPEEDBOARD C Prepreg
GORE SPEEDBOARD C Prepreg allows board designers to reap the high performance benefits of low Dk materials while fabricating on standard FR-4 manufacturing equipment. GORE SPEEDBOARD C Prepreg allows higher signal densities without sacrificing electrical performance. For multi-layer applications, GORE SPEEDBOARD C Prepreg materials increase signal speeds, provide superior signal integrity, and reduce the overall board thickness. A variety of available thicknesses facilitate controlled impedance designs.
-
How to Buy
For more information about buying this product or to request a quote, please contact us.
-
GORE SPEEDBOARD C Prepreg prepregs are sheets of expanded PTFE impregnated with thermoset resins. The air space inside the expanded PTFE is replaced with resin, and the ePTFE membrane becomes the carrier or the delivery system for the resin. The resin flows, fills, and bonds during the lamination process in the same way as conventional glass-based prepreg.
Material Properties
|
Dielectric constant at 1 MHz–40 GHz |
2.6 |
|
Loss tangent at 1 MHZ–40 GHz |
0.004 |
|
Dielectric strength (V/mil) |
>1,000 |
|
Glass transition temperature Tg (Celsius) |
220 |
|
Resin content (%) |
67-81 |
|
Color |
Opaque tan |
|
Flammability |
UL-94V-0 |
|
Pressed thickness (mils) (µm) |
1.5, 2.0, 2.2, 3.4 (38, 51, 57, 86) |
Advantages
- Low loss tangent
- Low dielectric constant
- Thin bonding layers
- Fast laser drilling
- Controlled flow and fill
- Replaces fusion bonding processes
- Uses standard PWB processing methods