GORE™ POLARCHIP® Thermal Interface Materials
GORE™ POLARCHIP® Thermal Interface Materials (TIMs) are the most compressible and conformable thermal gap fillers available. These pads are ideal for applications where gaps between heat sinks and heat-generating components are highly variable due to tolerance stack-ups or uneven component heights. As a result of its compressibility and ability to accommodate loose flatness tolerances, GORE™ POLARCHIP® TIMs minimize the extreme stresses to components and can eliminate secondary heat sink machining operations.
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How to Buy
For more information about buying this product or to request a quote, please contact us.
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Solutions Center
GORE™ POLARCHIP® TIMs are based on boron-nitride-filled ePTFE technology; are low in silicone content, and are available in several grades and thicknesses, depending on softness and thermal requirements. All of the GORE™ POLARCHIP® TIMs are provided in die-cut form with a pressure-sensitive adhesive, and they are strong and easy to handle. Gore also offers cost-effective peel-and-stick automated installation solutions to meet most manufacturing requirements
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GORE™ |
Available thickness (mm)* |
Compression |
Thermal Resistance |
Thermal Conductivity |
Max. Operating Temp. |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0.25 |
0.50 |
0.75 |
1.00 |
1.50 |
2.00 |
3.00 |
(values for 0.50 mm thick, @ 50 psi) |
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|
CP6000 |
• |
• |
• |
• |
|
• |
|
26% |
5.8 |
1.2 |
200°C |
|
|
CP8000 |
|
• |
• |
• |
• |
• |
|
61% |
5.2 |
0.7 |
110°C |
|
*Other thicknesses available upon request
Flammability rating (UL94): • V-0, • V-1, • HB
CP6000 was previously known as M20 Thermal Interface Material
Advantages
- Highly compressible with low stresses
- Excellent thermal conductivity and resistance
- Many grades and thicknesses available
- Automated installation
- Low silicone content